Wafer Thickness Measurement Device on Plate (Model TME-12)
This device measures the thickness of wafers fixed to ceramic plates without contact, using optical probes/sensors.
The measured data can be saved and displayed graphically on the accompanying PC. This device measures the thickness of the wafer attached to the plate and allows you to check the grinding condition before and after grinding while the wafer is attached to the plate.
- Company：ジャステム
- Price：Other
